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Catalog Number: (71009-320)
Supplier: KMG
Description: Ammonium hydroxide is used in a SC-1 solution to remove organics and particles from the surface of a wafer. The ammonium hydroxide allows undercuttin...
Catalog Number: (71009-358)
Supplier: KMG
Description: Hydrochloric Acid is a key ingredient to remove surface metallic ions by forming soluble metal chlorides.

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Catalog Number: (KM431-200440)
Supplier: KMG
Description: IPA is used to rinse silicon wafers and to leave a clean dry residue free surface usually after organic stripping solutions
Catalog Number: (71009-386)
Supplier: KMG
Description: Methyl ethyl ketone (MEK) is a strong solvent that is typically used as a negative photoresist remover.
Catalog Number: (71009-334)
Supplier: KMG
Description: Hydrogen peroxide is used in SC-1 and SC-2 solutions to remove particles from silicon wafers and to remove surface metallic contamination. The purity...
Catalog Number: (71009-382)
Supplier: KMG
Description: Sulfuric Acid is used in semiconductor processing to remove residual organic contamination prior to metalization steps. Store at less than 109⁰ F
Catalog Number: (71009-346)
Supplier: KMG
Description: Potassium hydroxide (KOH) is used to etch silicon. The crystalline orientation of the silicon greatly affects the etch rate making potassium hydroxid...
Catalog Number: (71009-366)
Supplier: KMG
Description: Hydrogen peroxide is used in SC-1 and SC-2 solutions to remove particles from silicon wafers and to remove surface metallic contamination. The purity ...
Catalog Number: (89400-756)
Supplier: KMG
Description: Buffered oxide etchants are used to etch thin films of silicon dioxide and shape contact and via openings.
Catalog Number: (71009-384)
Supplier: KMG
Description: Xylene can be used as a negative resist developer in semiconductor applications. Xylene is also mixed with HMDS, then spun on to a wafer to aid in adh...
Catalog Number: (71009-336)
Supplier: KMG
Description: Hydrogen peroxide is used in SC-1 and SC-2 solutions to remove particles from silicon wafers and to remove surface metallic contamination. The purity...
Catalog Number: (76312-644)
Supplier: KMG
Description: Acetone can be used for drying laboratory glassware, removing greasy or oily contaminants from work benches, or as a general photoresist stripper or e...
Supplier: KMG
Description: ACETONE CLEANROOM LP CAS 67-64-1 POLY 4L
Catalog Number: (71009-324)
Supplier: KMG
Description: In semiconductor processing, the presence of metallic impurities on the wafer can lead to early dielectric breakdown. Hydrochloric acid is a key ing...
Catalog Number: (89400-770)
Supplier: KMG
Description: Wet chemical etching is an integral part of semiconductor manufacturing process. KMG’s line of ultra etchants (BOE w/surfactant) offers a variety of s...
Catalog Number: (71009-532)
Supplier: KMG
Description: Sulfuric acid is used in semiconductor processing to remove residual organic contamination prior to metalization steps. Store at less than 109⁰ F
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Stock for this item is limited, but may be available in a warehouse close to you. Please make sure that you are logged in to the site so that available stock can be displayed. If the call is still displayed and you need assistance, please call us at 1-800-932-5000.
Stock for this item is limited, but may be available in a warehouse close to you. Please make sure that you are logged in to the site so that available stock can be displayed. If the call is still displayed and you need assistance, please call us at 1-800-932-5000.
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The original product is no longer available. The replacement shown is available.
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