Hydrogen peroxide 30%, Gigabit® for the electronics industry

Supplier: KMG
Danger

64018
71009-336CS 744.73 USD
71009-336
Hydrogen peroxide 30%, Gigabit® for the electronics industry
Hydrogen peroxide

Hydrogen peroxide is used in SC-1 and SC-2 solutions to remove particles from silicon wafers and to remove surface metallic contamination. The purity of the hydrogen peroxide is critical to surface roughness and metallic residual levels on the wafer.

Formula: H₂O₂
MW: 34.01 g/mol
Boiling Pt: ∼107 °C (1013 hPa)
Melting Pt: < 0 °C
Density: 1.11 g/cm³ (20 °C)
Storage Temperature: Ambient
MDL Number: MFCD00011333
CAS Number: 7722-84-1
EINECS: 231-765-0
UN: 2014
ADR: 5.1,II

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Specification Test Results

Assay H2O2 30 - 32 %
Color APHA Max 6
Free Acid Max 0.6 μeq/g
Total Organic Carbon Max 20000 ppb
Chloride Cl Max 30 ppb
Phosphate PO4 Max 100 ppb
Sulfate SO4 Max 100 ppb
Aluminum Al Max 1 ppb
Antimony Sb Max 1 ppb
Arsenic As Max 1 ppb
Barium Ba Max 1 ppb
Boron B Max 1 ppb
Cadmium Cd Max 1 ppb
Calcium Ca Max 1 ppb
Chromium Cr Max 1 ppb
Cobalt Co Max 1 ppb
Copper Cu Max 1 ppb
Gallium Ga Max 1 ppb
Germanium Ge Max 1 ppb
Gold Au Max 1 ppb
Iron Fe Max 1 ppb
Lead Pb Max 1 ppb
Lithium Li Max 1 ppb
Magnesium Mg Max 1 ppb
Manganese Mn Max 1 ppb
Molybdenum Mo Max 1 ppb
Nickel Ni Max 1 ppb
Niobium Nb Max 1 ppb
Potassium K Max 1 ppb
Sodium Na Max 1 ppb
Strontium Sr Max 1 ppb
Tin Sn Max 1 ppb
Zinc Zn Max 1 ppb
0.2 Micron Particle Count Max 250 Par/ml
0.5 Micron Particle Count Max 25 Par/ml
1.0 Micron Particle Count Max 25 Par/ml
Max 25 Par/ml

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