Copper ≥99.9985% (metals basis), foil, Puratronic®, Thickness 0.25 mm (0.01 in)

Supplier: Thermo Scientific Chemicals

11393-GH 11393-FI 011393-GH 011393-FI
AA11393-FIEA 88.69 USD
AA11393-FI AA11393-GH CAAA11393-FI CAAA11393-GH
Copper ≥99.9985% (metals basis), foil, Puratronic®, Thickness 0.25 mm (0.01 in)
Copper
Formula: Cu
MW: 63.55 g/mol
Boiling Pt: 2595 °C (1013 hPa)
Melting Pt: 1083 °C
Density: 8.94 g/cm³ (20 °C)
Storage Temperature: Ambient
MDL Number: MFCD00010965
CAS Number: 7440-50-8
EINECS: 231-159-6
Merck Index: 13,02545

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