Ultra 6:1

40889
89400-774CS 505.82 USD
89400-774
Ultra 6:1
Ultra Etch

Wet chemical etching is an integral part of semiconductor manufacturing process. KMG’s line of ultra etchants (BOE w/surfactant) offers a variety of silicon dioxide etching rates and characteristics to meet your processing needs.

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Specification Test Results

Assay (HF) 7.13 - 7.33%
Assay (NH4F) 33.60 - 34.60%
Color 10
Appearance Conform
Surface Tension 23 Dynes/cm
Chloride 2000 ppb
Nitrate 5000 ppb
Phosphate 400 ppb
Sulfate 1000 ppb
Aluminum 20 ppb
Antimony 5 ppb
Arsenic 5 ppb
Barium 10 ppb
Boron 10 ppb
Cadmium 10 ppb
Calcium 20 ppb
Chromium 10 ppb
Cobalt 10 ppb
Copper 10 ppb
Gallium 10 ppb
Germanium 10 ppb
Gold 10 ppb
Iron 20 ppb
Lead 10 ppb
Lithium 10 ppb
Magnesium 20 ppb
Manganese 10 ppb
Nickel 10 ppb
Potassium 20 ppb
Silver 10 ppb
Sodium 20 ppb
Strontium 10 ppb
Tin 20 ppb
Titanium 10 ppb
Zinc 10 ppb
0.5µ Particle Count 200 par/ml
1.0µ Particle Count 20 par/ml

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