Buffered oxide etch 12:2:5
62054
89400-752CS
608.31
USD
89400-752
Buffered oxide etch 12:2:5
Buffered oxide etch
Buffered oxide etchants are used to etch thin films of silicon dioxide and shape contact and via openings.
Specification Test Results
Assay (HF) | 5.35 - 5.65% |
Assay (NH4F) | 25.30 - 26.30% |
Color |
|
Appearance | Conform |
Chloride | 2500 ppb |
Nitrate | 5000 ppb |
Phosphate | 500 ppb |
Sulfate | 1500 ppb |
Aluminum | 25 ppb |
Antimony | 10 ppb |
Arsenic | 10 ppb |
Boron | 25 ppb |
Calcium | 25 ppb |
Chromium | 25 ppb |
Copper | 25 ppb |
Gold | 25 ppb |
Iron | 25 ppb |
Lead | 25 ppb |
Magnesium | 25 ppb |
Manganese | 25 ppb |
Nickel | 25 ppb |
Potassium | 25 ppb |
Sodium | 25 ppb |
Tin | 25 ppb |
Titanium | 25 ppb |
Zinc | 25 ppb |
0.2µ Particle Count | 3000 par/ml |
0.5µ Particle Count | 500 par/ml |
1.0µ Particle Count | 25 par/ml |
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